인텔, Lens Technology와 AI 반도체 패키징 협력
무슨 발표인가
- 유리 기판 기반 패키징 솔루션 개발
- 인텔의 고급 패키징 + Lens의 정밀 유리 가공
- AI·데이터센터 워크로드 성능 향상
원문 (영어)
Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era July 24, 2026 Published New Technologies Hide Show Image --> Collaboration combines Intel's advanced packaging expertise with Lens Technology's precision glass processing capabilities to deliver enhanced performance for future AI and datacenter workloads --> Share In this article: SANTA CLARA, Calif.
& CHANGSHA, China — Intel Corporation and Lens Technology today announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging. Through this work, the companies intend to explore opportunities to accelerate the development of glass substrate-based packaging solutions that can help enable higher performance, increased interconnect density, and improved power efficiency for future computing platforms.
Intel and Lens Technology will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.
“Advanced packaging is becoming a critical driver of semiconductor innovation as AI systems continue to push the boundaries of performance, scale, and efficiency," said Lip-Bu Tan, CEO of Intel. “Intel brings deep expertise in semiconductor architecture and advanced packaging technologies, while Lens Technology contributes world-class capabilities in precision glass processing, laser manufacturing, and large-scale production.
Together, we have an opportunity to explore new approaches to advanced packaging that can help unlock the next generation of system-level innovation for the AI era.”
원문: Intel Newsroom — "Intel and Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era" (2026-07-24) 공식 원문: https://newsroom.intel.com/new-technologies/intel-and-lens-technology-collaborate-to-enable-advanced-semiconductor-packaging-for-the-ai-era